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| Samsung Exynos 7 Dual Processor Credit: Samsung Electronics |
Samsung Electronics, a world leader in advanced semiconductor technology has announced that it has begun mass production of the Exynos 7 Dual 7270. It is the first mobile application processor (AP) in the industry designed specifically for wearable devices with 14-nanometer (nm) FinFET process technology. It is also the first in its class to feature full connectivity and LTE modem integration.
Over
a decade ago, Samsung has been leading the industry in expanding the adoption
of 14nm technology for a wide variety of products from premium smartphones to
entry-level mobile devices.
With
the Exynos 7270, the company also introduces the benefits of this cutting-edge
technology to wearables.
“The
Exynos 7270 presents a new paradigm for system-on-chips (SoC) dedicated to
wearables,” said Ben K. Hur, Vice President of System LSI Marketing at Samsung
Electronics.
“Designed
on our state-of-the-art process technology, this AP offers great power savings,
4G LTE modem and full connectivity solution integration, as well as innovative
packaging technology optimized for wearable devices.
It
is a ground-breaking solution that will greatly accelerate wider adoption of
wearable devices by overcoming limitations in current solutions such as energy
usage and design flexibility.”
Powered
by two Cortex®-A53 cores, the Exynos 7270 makes full use of the 14nm
process, delivering 20 percent improvement in power efficiency when compared to
its predecessor built on 28nm, and thus notably extending the battery life.
By
integrating Cat.4 LTE 2CA modem, the new AP allows wearables to connect to a
cellular service as a stand-alone device. Tethering and data transfer between
devices is also possible with its embedded WiFi and Bluetooth connectivity.
In
addition, integrated connectivity capabilities support FM (frequency
modulation) radio, and location-based services with GNSS (global navigation
satellite system) solutions.
As
well as the implementation of the advanced 14nm FinFET process, Samsung’s
innovative packaging technology, SiP(system-in-package)-ePoP(embedded
package-on-package), enables the Exynos 7270 to feature outstanding performance
and energy-efficiency within a compact solution optimized for wearable devices.
The
technology combines the AP, DRAM and NAND flash memory chips as well as the
PMIC (power management IC) together into a single package. The solution can
offer more features than its predecessor in the same 100-square-millimeter (mm2)
area while reducing the height by approximately 30 percent.
This
gives more room for device manufacturers to design high performance, ultra-slim
wearable devices.
To
expedite the development process, a reference platform comprised of the Exynos
7270, NFC (near field communication) and various sensors is currently available
for device manufacturers and customers.
Source: Samsung Newsroom
Source: Samsung Newsroom
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